Hello,
I would like to know if there is an option in Proteus to assign via filling with Resin.
Best regards,
Via Filling with Resin
Re: Via Filling with Resin
Hi,
If I understand you correctly this would be for via in pad (e.g. BGA) ? This is not currently supported but can I first check requirements with you ?
I think it would largely be an output feature. We'd need a way to specify a via as resin filled (global option for vias-in-pads or per via?) and then a separate drill file in the Gerber output. Anything else ?
If I understand you correctly this would be for via in pad (e.g. BGA) ? This is not currently supported but can I first check requirements with you ?
I think it would largely be an output feature. We'd need a way to specify a via as resin filled (global option for vias-in-pads or per via?) and then a separate drill file in the Gerber output. Anything else ?
Re: Via Filling with Resin
We've implemented support for resin filled vias (NCVF) with the release of Version 8.14. Ref: https://s3.amazonaws.com/labcenter/movi ... dVias.html